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luxpia co.,ltd. 948-1, dunsan-li bongdong-eup, wa nju-gun, jeonbuk, korea tel 82-63-260-4500 fax 82-63-261-8255 comments luxpia co., ltd. date : . . . date : . . . designed by checked by approved by approved by approved by approved by / / / / / / part no. : LWH1036n s p ecification for a pp roval ( version 1.0 )
1/14 - contents - 1. features 2. package outline dimensions and materials 3. absolute maximum ratings 4. electro-optical characteristics 5. cie chromaticity diagram 6. materials 7. taping 8. packing 9. reliability 10. cautions 11. warranty 12. others 13. characteristic diagrams 2/14 1. features ? package : smd top view type (3chips in 1) ? dimension : 3.5 2.8 0.9 mm (lwh) ? small size surface mount type ? viewing angle : extremely wide(120 ? ) ? soldering methods : ir reflow soldering 2. package outline dimensions and recommended solder patterns 3/14 3. absolute maximum ratings 1) (t a =25 ? ) item symbol value unit forward current i f 90 ma pulse forward current 2) i fp 300 ma reverse current v r 5 v power dissipation p d 320 mw operating temperature t opr -30 to+85 ? storage temperature t stg -40 to +100 ? 1) these values are based on 3-die performance 2) i fp conditions : pulse width 10msec & duty ratio 1/10 4. electro-optical characteristics (t a =25 ? ) item rank symbol condition min typ max unit 0 2.9 - 3.1 1 3.1 - 3.2 2 3.2 - 3.3 3 3.3 - 3.4 4 3.4 - 3.5 forward voltage 3) 5 v f i f = 60ma 3.5 - 3.6 v 3e25 2.5 - 3.5 3e35 3.5 - 4.5 luminous intensity 4) 3e45 i v i f = 60ma 4.5 - 5.5 cd reverse current - i r v r = 5v - - 150 u 3) forward voltages are tested at a current pulse duration of 10 ms and an accuracy within 0.1v. 4) the allowance of luminous intens ity measurement is within 11%. * to avoid optical difference, please do not mix differently ranked product. 4/14 5. cie chromaticity diagram 5) 5) the allowance of color coordinates measurement is wi thin 0.01. (cie1931 standard colorimetric system) x y xyxyxyxyxyxy 0.280 0.245 0.292 0.266 0.301 0.282 0.311 0.295 0.319 0.306 0.330 0.325 0.348 0.365 0.272 0.270 0.282 0.287 0.293 0.305 0.305 0.329 0.316 0.350 0.330 0.380 0.348 0.412 0.282 0.287 0.293 0.305 0.305 0.329 0.316 0.350 0.330 0.380 0.348 0.412 0.374 0.465 0.292 0.266 0.301 0.282 0.311 0.295 0.319 0.306 0.330 0.325 0.348 0.365 0.374 0.413 c7 cct 10000-13300 cct 8000-10000 cct 7000-8000 cct 6500-7000 cct 5600-6500 cct 5000-5600 cct 4500-5000 c1 c2 c5 c6 c3 c4 0.20 0.22 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.25 0.26 0.27 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.39 0.40 x y c1 c2 c3 c4 c5 c6 c7 13300k 10000k 7000k 5600k 5000k 8000k 6500k 4500k (t a =25 ? , i f =60ma) 5/14 6. materials item material led chip ingan wire gold lead frame copper alloy/ni/ag plating encapsulation silicone resin + phosphor heat-resistant polymer ppa 7. taping 7.1. tape (material : ps conductive, 10 4 ~10 5 ? ) (units : mm) 6/14 7.2. wheel (color : black, material : ps conductive, 10 9 ~10 12 ? ) (units : mm) - quantity per reel LWH1036n : 3,500 pcs 7.3. label part no. size (l x w) : 85mm 50mm color rank i v rank v f rank LWH1036n c2 -3e35 -3 3 , 500ea 7/14 8. packing ? the leds are packed in cardboard boxes after taping. the label shows part number, lot number, rank, and quantity. ? in order to protect the leds from mechanical shock, they are packed with cardboard boxes for transportation. ? the leds may be damaged if the boxes are dropped or receive a strong impact against them, so cautions must be taken to prevent any possible damage. ? the boxes are not water-resistant and, theref ore, must be kept away from water and moisture. ? when the leds are transported, it is recommended that the same packing method as luxpia's is used. ? if noticeable damage on a box appears upon ar rival at the user?s warehouse, the user should submit a claim to luxpia within one week after arrival of the products. 8/14 9. reliability 9.1. test items and results no test item standard test method test conditions note number of damaged 1. resistance to soldering heat (reflow soldering) jeita ed-4701 300 301 tsld=260c, 10sec. (pre treatment 30c,70%,12hrs) 1 times 0/22 2 solderability (reflow soldering) jeita ed-4701 300 303 tsld=2155c, 3sec (lead solder) 1 time over 95% 0/22 3 temperature cycle jeita ed-4701 100 105 40 ? ~25 ? ~100 ? ~25 ? 30min. 5min. 30min. 5min 100 cycles 0/22 4 high temperature storage jeita ed-4701 200 201 t a =100 ? 1000 hrs 0/22 5 te m p e ra t u re humidity storage jeita ed-4701 100 103 t a =60 ? , rh=90% 1000 hrs 0/22 6 low temperature storage jeita ed-4701 200 202 t a =-40 ? 1000 hrs 0/22 7 steady state operating life condition - t a =25 ? , i f =60ma 1000 hrs 0/22 8 steady state operating life of high temperature - t a =85 ? , i f =15ma 1000 hrs 0/22 9 steady state operating life of high humidity heat - 60 ? , rh=90%, i f =30ma 500 hrs 0/22 10 steady state operating life of low temperature - t a =-30 ? , i f =60ma 1000 hrs 0/22 * led with luxpia standard circuit board 9/14 9.2. criteria for judging the damage criteria for judgement item symbol test condition min max forward voltage v f i f = 60ma - u.s.l. 6) 1.1 luminous intensity i v i f = 60ma l.s.l. 7) 0.5 - 6) u.s.l. : upper standard level 7) l.s.l. : lower standard level 10. cautions white leds are devices which are materialized by combining blue leds and special phosphors. consequently, the color of white leds is subject to change a little by an operating current. care should be taken after due co nsideration when using leds. (1) moisture-proof package ? when moisture is absorbed into the smt package it may vaporize and expand products during soldering. there is a possibility that this may ca use exfoliation of the cont acts and damage to the optical characteristics of the leds. for this reason, the moisture-proof package is used to keep moisture to a minimum in the package. ? a package of a moisture-absorbent material (silica gel) is inserted into the shielding bag. the silica gel changes its color from blue to pink as it absorbs moisture. (2) storage ? storage conditions - before opening the package : the leds should be kept at 30 or less and 90%rh or less. ? the leds should be used within a year. when storing the leds, mois ture-proof packaging with moisture -absorbent material (silica gel) is recommended. - after opening the package : the leds should be kept at 30 or less and 70%rh or less. ? the leds should be soldered within 168 hours (7 days) after opening the package. if unused leds remain, they should be stored in moisture-proof packages, such as sealed containers with packages of moisture-absorbent material (silica gel). it is also recommended to return th e leds to the original mo isture-proof bag and to reseal the moisture-proof bag again. ? if the moisture-absorbent mate rial (silica gel) has faded away or the leds have exceeded the rocommended storage time, baking treatment should be performed using th e following conditions. - baking treatment : more than 24 hours at 655 ? 10/14 ? luxpia's led electrode sections are comprised of a silver-plated copper alloy. the silver surface may be affected by environments which contain co rrosive gases and so on. please avoid condition which may cause difficulty during soldering operat ions. it is recommended that the user use the leds as soon as possible. ? please avoid rapid transitions in ambient temper ature, especially in high humidity environments where condensation can occur. (3) heat generation ? thermal design of the end product is of paramount importance. please consider the heat generation of the led when the system is designed. the coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of led placement on the board, as well as other components. it is necessary to avoid intense heat generation and operate within the maximum ratings given in the specification. ? the operating current should be decided after considering the ambient maximum temperature of leds. (4) soldering conditions ? the leds can be soldered in place using the reflow soldering method. luxpia does not make any guarantee on the leds after they have been assembled using the dip soldering method. ? the leds can be soldered in place using the reflow soldering method. luxpia does not make any guarantee on the leds after they have been assembled using the dip soldering method. ? recommended soldering conditions reflow soldering hand soldering lead solder lead-free solder pre-heat pre-heat time peak temperature soldering time condition 120~150 ? 120sec max 240 ? max 10sec max refer to profile y 180~200 ? 120sec max 260 ? max 5sec max refer to profile t temperature soldering time 350 ? max 3sec max (one time only) * after reflow soldering, rapid cooling should be avoided. [temperature-profile (surface of circuit board)] use the conditions shown to the following figures. < y : lead solder> < t : lead-free solder> 5 j n f < |